Ion Milling / Sputtering / E-Beam System from TSST

Ion Milling / Sputtering / E-Beam System from TSST

Ion Milling/Sputtering/E-Beam from TSST is a system made up of a combination of three techniques in the same equipment. The system is furnished of an ion miller which allows to thin samples by argon (Ar) ions bombardment. Also it is possible to deposit gold (Au), silver (Ag), platinum (Pt) and copper (Cu) by DC sputtering and to evaporate several metals by electron beam.

FEATURES:

  • General: load lock chamber with an annealing system at oxygen pressure. Rotating sample holder system.
  • Ion Miller: gridded 4 cm diameter source with a beam voltage from 100 to 1200 V DC, and a beam current of about 100 mA.
  • Sputtering: sputter sources for 1-inch Au, Ag, Pt and Cu sputter targets. Two DC sputtering guns with 600 W DC power supply with a single output channel and a maximum current of 1.3 A.
  • Electron Beam: two evaporation sources with controlled evaporating flux, possibility to evaporate metals with molybdenum (Mo) crucible and in rods of between 2-6 mm diameter.

The equipment was co-funded by infrastructural projects (MINECO + FEDER) CSIC-13-4E-1798 y MINECO MAT2011-28874-CO2-01. Equipamiento cofinanciado por proyectos de infraestructura (MINECO + FEDER) CSIC-13-4E-1798 y MINECO MAT2011-28874-CO2-01.

CONTACT US

Phone: (+34) 935 801 853

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Tlf.: (+34) 935 801 853; ext. 363/335
staff 02 50   This email address is being protected from spambots. You need JavaScript enabled to view it.
Tlf.: (+34) 935 801 853; ext. 364/335
staff 02 50   This email address is being protected from spambots. You need JavaScript enabled to view it.
Tlf.: (+34) 935 801 853; ext. 365/335

NANOQUIM @ 2017